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公司基本資料信息
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在線式選擇性波峰焊 型號 SUNFLOW3
機體參數(shù)
General technical data
最大PCB 板尺寸/Max PCB size (mm) 510(L)x450(W)
最小PCB 板尺寸/Min PCB size (mm) 120(L)x50(W)
PCB 頂部間隙/PCB top side
clearance (mm) 120
PCB 底部間隙/PCB bottom side
clearance (mm) 30
PCB 工藝邊/PCB technics side
(mm) ≥3
傳送帶距離地面高度/Conveyor height from floor (mm) 850±25
PCB 傳送速度/PCB conveyor
speed (m/min) 0-12
PCB 重量/Max PCB weight
(kg) ≤5
PCB 厚度(包含治具)/PCB
thickness (including fixture) (mm) 1-6
傳送帶可調范圍/Conveyor width adjustment (mm) 50-450
傳送帶調寬方式/Conveyor width adjustment mode 電動/Electromotion
傳送帶可調寬精度/Conveyor width adjusted accuracy (mm) ±0.1
PCB 傳送方向/PCB Conveyor
direction 左向右/Left to right
壓縮空氣所需壓力/Compressed air required pressure (Mpa) 0.5-0.8
電源電壓/Main voltage(VAC) 380
電壓容差/Voltage tolerance range (%) 6-10
頻率/Frequency (HZ) 50/60
最大功耗/Max power consumption (kw) <25
最大電流/Max amperage (A) <34
環(huán)境溫度/Ambient temperature (℃) 10-35
機器噪音/Permanent sound level (dB) <65
通訊接口/Communication interface SMEMA
設備外形尺寸/Overall dimensions(mm) 3010(L)*1620(W)*1700(H)
設備重量/Equipment weight(kg) 2000
焊接系統(tǒng)
Soldering module
焊接噴嘴/Solder nozzle 高精度單噴嘴/High precision single nozzle
最小噴嘴外徑/Smallest nozzle outer diameter (mm) 5.5
噴嘴內(nèi)徑/Nozzle inner diameter (mm) 2.5-10
最大波峰高度/Max solder wave height (mm) 5
錫爐容量/Solder volume (kg) 5
最大焊接溫度/Max solder temperature (℃) 350±2
錫爐加熱功率/Soldering heating power (kw) 1.3
氮氣供應/Nitrogen supply 由客戶提供/Offered by
customer
氮氣所需壓力/Nitrogen required pressure (Mpa) 0.3
氮氣消耗量/Nitrogen consumption (m3/h) 1.2
所需氮氣純度/Required particle cleanliness (%) ﹥99.99
預熱系統(tǒng)
Preheating module
預熱溫度范圍/Preheat temperature range (℃) 0-200
預熱控溫精度/Preheat control accuracy (℃) ±2
加熱功率/Preheating medium (kw) 21
PCB 溫度均勻性/PCB temperature
uniformity (℃) 5
加熱方式/Preheating medium 熱風+紅外/Hot
air+Infrared
頂部預熱/Top side preheating 熱風/Hot air
噴霧系統(tǒng)
Flux module
噴霧高度/Spray height(mm) 60
噴霧速度/Control speed(mm/s) ≤400
噴嘴自動清洗功能/Spray head automatically cleaning 程序控制/Program
control
助焊劑流量/Flux consumption(ml/min) 2-60
助焊劑箱體容量/Flux content(L) 2
