| 外形尺寸：14.6mm*12.6mm*2.1mm |
| 參數(shù)配置 ：Micro SD+M2卡座 |
1.MATERIAL
Insulator:High Temperature Thermoplastic,
UL94V-O
Contact:Copper Alloy
Shell:Copper Alloy
2.PLATING
Contact Area:Gold PLATED Over Ni.
Solder Tail:Sn PLATED Over Ni.
Shell Solder Arda:Gold PLATED Over Ni.
3.ELECTRICAL
Operating Temperature:-25℃ TO+90℃
Current Rating:0.5mA max.
Contact Resistance:100mΩ max.
Insulation Resistance:1000MΩ min./500VDC |
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